Fillings and thermal managment

These elements include different pads, materials for filling the gaps (spacer), thickness adjustment, or dimensional adjustments.

This group includes also materials for:

  • thermal management. Modern electronic components can generate considerable heat. Therefore, it is necessary to control the dispersion of the generated heat in order to ensure reliable functionality.
  • optical elements, e.g. optically clear, diffusion or light blocking foils, etc.